What will happen after the emergence of chip-scale packaging (CSP) technology, and will it end the traditional packaging? At the LEDforum 2014 China International LED Market Trend Summit Forum hosted by China LED Network and Guangzhou International Lighting Exhibition, , CTO of Ruifeng Optoelectronics, also gave his own answer-‘The worry that CSP will eat traditional packaging is a bit overwhelming. ,
But the emergence of CSP will definitely have an impact on the original package form, especially the old product line, especially high-power products, ceramic high-power packages’ . After more than 20 years of research and development of packaging technology, self-deprecating engineers from the underlying technology and overall solutions have gradually become feng shui masters in the packaging industry. believes, ‘CSP is definitely a new trend in packaging in the future, but its penetration rate and market share
It’s not as big as imagined. Since CSP is a package without a support and a substrate, and from the perspective of phosphor coating, the technical route taken by CSP may be the coating of liquid phosphors and fluorescent glue, or it can be Coating of solid fluorescent film. In this regard, the investment in related equipment may change.’ At the same time, pointed out that after the emergence of CSP,
it seems possible IP65 industrial led light the chip jumps directly to the lamp. And whether the package is short-circuited, whether the chip factory and the packaging factory have changed from their original partners to rivals, and how should the chip factory and the packaging cooperate? emphasized, ‘
This market cannot be monopolized. CSP is not a unique advantage of the chip factory. The packaging factory does not necessarily do CSP worse than the chip factory. And the packaging factory has a vast customer resource, and the chip factory can provide CSP. The module is made by the packaging factory, and then delivered to the downstream application customer.’ics, is particularly worth noting that when LED lighting gradually moves towards standardization, the module form derived from the package and the application side will also become an industrial form.
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