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The characteristics of chip-level small size and high optical density

With this new component architecture, customers can break through the limitations of existing packaged LED light sources and meet the innovative applications and flexible needs of lamps. PoD technology has the characteristics of chip-level small size and high optical density, and is especially suitable for concentrating lamps such as MR16 and GU10. It can become an LED light-emitting component waterproof led wall pack with sensor without additional packaging process.com OASIS held a product launch and promotion meeting. Tan Changlin, general manager of TSMC solid-state lighting, said,

‘The successful development of packageless PoD module technology and the mass production of TRx series products are TSMC is a major milestone in LED technology research and development. This time TSMC has launched mass-produced TRx series products, including TR5 and TR7 series of lamp panels, which can replace 25W and 35W traditional halogen light sources MR16,

respectively. Used in MR16 and GU10 bulbs, it will be easy to create optical design consistent with traditional halogen light rotation performance without heavy It also helps manufacturers to create product value and accelerate the speed of product launches.” TSMC will participate in the 10/27-10/30 in Hong Kong

The 2013 Hong Kong International Lighting Fair (Autumn Edition) will display unpackaged PoD modules and TRx series products and applications at Hall 1 Hall 1 Famous Lamps Gallery 1CON-027, and at Hall 3C from 2:00-3:00 pm on 10/27 hktdc.. At present, TSMC solid-state lighting company has developed TRx series of light board products using non-encapsulated PoD module technology. Dr. The launch of package-free PoD module technology fully proves TSMC’s determination and strength to promote technological innovation

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